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PSOIC / PSSOP

These off-the-shelf packages are constructed of a semiconductor grade plastic and feature a gold plated copper die attach pad and lead frame. 

Open Cavity packages can be sealed with ceramic or plastic lids or with an epoxy glob top. 

They have the same mechanical and electrical characteristics as their transfer molded counterparts and are fully compatible with the same test fixtures. 

Advantages of PSOIC/PSSOP: 

  • Newly manufactured material 
  • Great quick turn assembly solution 
  • Same footprint as production plastic packages 
  • Easy to seal 
  • Meets QQ-N-290, MIL -G45204C and MIL -Std-883 specifications
All dimensions are in inches unless otherwise specified
SSM P/N Lead Count Part Type Mfg Drw No Cavity Size (W) Cavity Size (L) Pkg OD (L) Pkg OD (W) S/R OD (L) S/R OD (W) S/R ID (L) S/R ID (W) B/F Layout Recom Lid Comments PDF Req Quote
PSO081504 8 PSOIC 500520 Rev A 0.075 0.1 0.195 0.152 CR181403 Req Quote
PSO141501 14 PSOIC SOIC14-OP-01 0.075 0.1 0.342 0.155 PL301501 Req Quote
PSO161501 16 PSOIC SOIC16-OP-01 0.075 0.12 0.39 0.155 PL301501 Req Quote
PSO161502 16 PSOIC SOIC16-OP-02 REV.1 0.15 0.22 0.41 0.295 CR372703 Req Quote
PSO203001 20 PSOIC SOIC20-OP-01-T 0.15 0.22 0.51 0.31 CR502805 Req Quote
PSO243001 24 PSOIC SOIC24-OP-01-T 0.15 0.22 0.61 0.295 CR502805 Req Quote
PSP161501 16 PSSOP SSOP16-OP-01 0.075 0.1 0.193 0.152 CR181401 Req Quote
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