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Hybrid Package - Multi-Chip Module (MCM)

A Hybrid Package is a special carrier of hybrid microcircuits and components interconnected as one unit.  It can be considered a component of an electronic subsystem. 

The Hybrid may consist of a single construction or be made up of sub-modules.  Each module usually contains a compartment to house the hermetically packaged hybrids and discrete passive component parts such as transformers, axle-lead resistors, etc. 

These packages come in a wide variety of package configurations; Ceramic, Metal, DIP style and Flat Pack. 

Advantages of Hybrid Packages: 

  • Wide variety of package configurations and lead counts 
  • Packages available in metal, DIP style, Flat Pack 
  • Hermetic
All dimensions are in inches unless otherwise specified
SSM P/N Lead Count Part Type Mfg Drw No Cavity Size (W) Cavity Size (L) Pkg OD (L) Pkg OD (W) S/R OD (L) S/R OD (W) S/R ID (L) S/R ID (W) B/F Layout Recom Lid Comments PDF Req Quote
HYB00201 2 HYBRID KM-1017 0.48 0.535 0.65 0.59 0.65 0.59 0.595 0.54 Req Quote
HYB01405 14 HYBRID KD-80095-A 0.17 0.55 0.77 0.31 0.71 0.29 0.575 0.221 0X7 CL652704 Req Quote
HYB01406 14 HYBRID KPP-08700498-014-008 0.3 0.6 0.855 0.493 0X7 PLATFORM PACKAGE, PIN # 4 GRND Req Quote
HYB01605 16 HYBRID KD-H96492-JMI 0.44 0.65 0.85 0.6 0.85 0.59 0.71 0.49 0X8 Req Quote
HYB01607 16 HYBRID IDK16F1-941L 0.17 0.65 0.8 0.31 0.77 0.395 0.65 0.22 0X7 CL752702 Req Quote
HYB02002 20 HYBRID 52007D 0.55 0.9 1.131 0.822 NEO CAN02002 Req Quote
HYB02413 24 HYBRID KD-H86255-B 0.43 1.05 1.25 0.61 1.25 0.59 1.11 0.49 0X12 CLX195601 Req Quote
HYB02416 24 HYBRID IDK24F1-7405B 0.58 1.144 1.295 0.79 1.295 0.79 1.179 0.58 SIDES ONLY CLX277701 Req Quote
HYB04004 40 HYBRID PB114214EC057J 0.8 1.9 2.14 1.14 2.14 1.14 1.9 0.9 NEO CRX2141101 Req Quote
HYB04402 44 HYBRID PB100230EC005 2.3 1 0X22 Req Quote
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