Skip to main content
Spectrum Semiconductor Materials
Main navigation
Products
Packages
Cerquad
Cerdip
Cerpac
Chip Carriers
LDCC (Leaded Chip Carrier)
Leadless Chip Carrier (LCC)
Hybrid (MCM)
SOIC (Small Outline IC)
PGA (Pin Grid Array)
Ceramic
Plastic
Sidebraze (DIP)
Transistor Outline Packages
Power Transistor Outline (TO) Package
TO Cans
TO Headers
Open Cavity Plastic Packages
PQFN
PQFP
PSOIC / PSSOP
SMD (Surface Mount Devices)
Lids
Ceramic Solder Lids
Rectangle
Square
Ceramic
Cerquad Lids
Rectangle
Square
Combo Lids™
Rectangle
Square
Glass Lids
Rectangle
Square
Stepped Lids
Rectangle
Square
Quality
Company
Message From the President
Company Overview
Our Mission Statement
Customer Satisfaction Survey
Contact
Feedback
Register/Login
Home
CDC02423
Read more
about CDC02423
CDC02420
Read more
about CDC02420
CDC02419
Read more
about CDC02419
CDC02418
Read more
about CDC02418
CDC02417
Read more
about CDC02417
CDC02416
Read more
about CDC02416
CDC02415
Read more
about CDC02415
CDC02414
Read more
about CDC02414
CDC02413
Read more
about CDC02413
CDC02412
Read more
about CDC02412
Pagination
« First
First page
‹ Previous
Previous page
…
316
317
318
319
320
321
322
323
324
…
Next ›
Next page
Last »
Last page
Subscribe to