Ceramic Solder Seal lids are a variation of the metal Combo Lid™ which has been a standard in the semiconductor industry for decades. Our variation of the combo lid features a flat 90% Alumina ceramic cover with a metalized sealing surface along the outer edge.
The metalized sealing surface is Ni/Au plated and an industry standard preform (80Au/20Sn) is then tacked securely onto the ceramic cover. The end result is a ceramic lid that can be solder sealed for full hermeticity that also offers the ease of handling of a metal Combo Lid™ with the added benefits of the ceramic materials.
Some customers that have used these lids state their products meet JAN,JANTX, JANTXV and JANS quality levels per MIL-PRF-19500 and MIL-STD-750*
Advantages of Ceramic Solder Lids:
- Increased resistance to salt spray corrosion
- Improved hermetic seal after temp cycling due to matching thermal coefficient of expansion (TCE)
- Ceramic surface promotes better marking of finished devices
Improved protection from XRAY threat
*Spectrum recommends that customers evaluate these lids in their facility for their specific application and qualification requirements.
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