products
Small Outline Integrated Circuit Package (SOIC)
The SOIC package is a surface mounted device designed to meet the demand for increasing miniaturization and component density. The SOIC package is a rectangular "Dual In-line" style ceramic package.
The body sizes are typically smaller than a standard package. They are on a .050" lead spacing and typically come in lead counts ranging from 8-24 leads andhave a Gullwing lead configuration.
Advantages of Ceramic SOIC:
- Multilayer Package
- Solder, Glass or Epoxy Seal
- Gold Plated Leads
- Surface Mount
- Comparable footprint to Plastic SOIC
All dimensions are in inches unless otherwise specified
Don’t see what you are looking for? Please Contact Us as our electronic catalog is dynamic and changes daily
SSM P/N | LEAD COUNT | PART TYPE | MFG DRW NO | CAVITY SIZE (W) | CAVITY SIZE (L) | PKG OD (L) | PKG OD (W) | S/R OD (L) | S/R OD (W) | S/R ID (L) | S/R ID (W) | B/F LAYOUT | RECOM LID | COMMENTS | REQ.QUOTE | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CSO00802 | 8 | SOIC | G1616M-1F REV D | 0.07 | 0.09 | 0.18 | 0.18 | 0.166 | 0.166 | 0.126 | 0.126 | 4X0 | CL-16007 | VIEW | Req.Quote | |
CSO008P3 | 8 | SSOP | GW2112G-1 | 0.06 | 0.11 | 0.208 | 0.118 | 4X0 | VIEW | Req.Quote | ||||||
CSO008P4 | 8 | TSSOP | GW2017G-2 | 0.08 | 0.118 | 0.178 | 0.123 | 4X0 | VIEW | Req.Quote | ||||||
CSO01602 | 16 | SOIC | PB-F88151 | 0.17 | 0.283 | 0.411 | 0.293 | 0.404 | 0.285 | 0.333 | 0.215 | 2X6 | CL372609 | VIEW | Req.Quote | |
CSO02003 | 20 | SOIC | PB-F86652-C | 0.161 | 0.283 | 0.504 | 0.293 | 0.413 | 0.285 | 0.342 | 0.215 | 4X6 | CL372609 | VIEW | Req.Quote | |
CSO02005 | 20 | SOP | L20Z0-9020A | 0.089 | 0.157 | 0.342 | 0.155 | 6X4 | LEADS TRIMMED & FORMED | VIEW | Req.Quote | |||||
CSO02006 | 20 | SOJ | IDK20F1-7933A | 0.215 | 0.49 | 0.675 | 0.33 | 0.655 | 0.312 | 0.57 | 0.23 | EO | CL622801 | VIEW | Req.Quote | |
CSO02007 | 20 | SOJ | IDK20F1-7829B | 0.215 | 0.49 | 0.675 | 0.329 | 0.655 | 0.312 | 0.57 | 0.229 | EO | CL622703 | D/A CONNECTED TO GND PAD | VIEW | Req.Quote |
CSO02404 | 24 | SOIC | PB-F88153 | 0.17 | 0.283 | 0.606 | 0.293 | 0.404 | 0.285 | 0.333 | 0.215 | 6X6 | CL372609 | VIEW | Req.Quote | |
CSO02406 | 24 | SOIC | PB-F86653-A | 0.172 | 0.285 | 0.611 | 0.293 | 0.407 | 0.288 | 0.335 | 0.216 | 6X6 | CL372609 | Req.Quote | ||
CSO02802 | 28 | SOIC | PB-F88154 | 0.17 | 0.283 | 0.705 | 0.293 | 0.404 | 0.285 | 0.333 | 0.215 | 6X8 | CL372609 | VIEW | Req.Quote | |
CSO028P2 | 28 | SOIC | GW6030G-6 | 0.165 | 0.205 | 0.6 | 0.3 | 6X8 | VIEW | Req.Quote | ||||||
CSO028P3 | 28 | SOIC | GW6030G-5 | 0.165 | 0.205 | 0.6 | 0.3 | 6X8 | CR562702 | VIEW | Req.Quote |