products
Ceramic Solder Seal Lids - Rectangle
Ceramic Solder Seal lids are a variation of the metal Combo Lid™ which has been a standard in the semiconductor industry for decades. Our variation of the combo lid features a flat 90% Alumina ceramic cover with a metalized sealing surface along the outer edge.
The metalized sealing surface is Ni/Au plated and an industry standard preform (80Au/20Sn) is then tacked securely onto the ceramic cover. The end result is a ceramic lid that can be solder sealed for full hermeticity that also offers the ease of handling of a metal Combo Lid™ with the added benefits of the ceramic materials.
Some customers that have used these lids state their products meet JAN,JANTX, JANTXV and JANS quality levels per MIL-PRF-19500 and MIL-STD-750*
Advantages of Ceramic Solder Lids:
- Increased resistance to salt spray corrosion
- Improved hermetic seal after temp cycling due to matching thermal coefficient of expansion (TCE)
- Ceramic surface promotes better marking of finished devices
- Improved protection from XRAY threat
*Spectrum recommends that customers evaluate these lids in their facility for their specific application and qualification requirements.
SSM P/N | PART TYPE | MFG DRW NO | THICKNESS | LID OD (L) | LID OD (W) | LID ID (L) | LID ID (W) | SEALANT | COMMENTS | REQ.QUOTE | |
---|---|---|---|---|---|---|---|---|---|---|---|
CRA109002 | CERAMIC SOLDER LID | N/A | 0.02 | 0.106 | 0.09 | 0.071 | 0.06 | WITH AU/SN PREFORM | VIEW | Req.Quote | |
CRA221502 | CERAMIC SOLDER LID | N/A | 0.02 | 0.225 | 0.15 | 0.185 | 0.12 | WITH AU/SN PREFORM | VIEW | Req.Quote |