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Small Outline Integrated Circuit Package (SOIC)

The SOIC package is a surface mounted device designed to meet the demand for increasing miniaturization and component density.  The SOIC package is a rectangular "Dual In-line" style ceramic package. 

The body sizes are typically smaller than a standard package. They are on a .050" lead spacing and typically come in lead counts ranging from 8-24 leads and have a Gullwing lead configuration. 

Advantages of Ceramic SOIC: 

  • Multilayer Package 
  • Solder, Glass or Epoxy Seal 
  • Gold Plated Leads 
  • Surface Mount 
  • Comparable footprint to Plastic SOIC
All dimensions are in inches unless otherwise specified
SSM P/N Lead Count Part Type Mfg Drw No Cavity Size (W) Cavity Size (L) Pkg OD (L) Pkg OD (W) S/R OD (L) S/R OD (W) S/R ID (L) S/R ID (W) B/F Layout Recom Lid Comments PDF Req Quote
CSO00802 8 SOIC G1616M-1F REV D 0.07 0.09 0.18 0.18 0.166 0.166 0.126 0.126 4X0 CL-16005 Req Quote
CSO008P3 8 SSOP GW2112G-1 0.06 0.11 0.208 0.118 4X0 Req Quote
CSO008P4 8 TSSOP GW2017G-2 0.08 0.118 0.178 0.123 4X0 Req Quote
CSO01602 16 SOIC PB-F88151 0.17 0.283 0.411 0.293 0.404 0.285 0.333 0.215 2X6 CL372609 Req Quote
CSO02003 20 SOIC PB-F86652-C 0.161 0.283 0.504 0.293 0.413 0.285 0.342 0.215 4X6 CL372609 Req Quote
CSO02005 20 SOP L20Z0-9020A 0.089 0.157 0.342 0.155 6X4 LEADS TRIMMED & FORMED Req Quote
CSO02404 24 SOIC PB-F88153 0.17 0.283 0.606 0.293 0.404 0.285 0.333 0.215 6X6 CL372609 Req Quote
CSO02802 28 SOIC PB-F88154 0.17 0.283 0.705 0.293 0.404 0.285 0.333 0.215 6X8 CL372609 Req Quote
CSO028P2 28 SOIC GW6030G-6 0.165 0.205 0.6 0.3 6X8 Req Quote
CSO028P3 28 SOIC GW6030G-5 0.165 0.205 0.6 0.3 6X8 CR562702 Req Quote
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